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STPS16150CT - STMicroelectronics

Description: 150 V, 16 A dual Power Schottky Rectifier

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STPS16150CT - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ---0TO-220_(Height=4.6mm)
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STPS16150CT - STMicroelectronics  - 3D model - Transistor Outline, Vertical - ---0TO-220_(Height=4.6mm)
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STPS16150CT Details

  • Manufacturer Part Number:

    STPS16150CT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.32

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS16150CT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To protect the device from EOS, use a robust PCB design, ensure proper voltage regulation, and consider adding transient voltage suppressors (TVS) or electrostatic discharge (ESD) protection devices to prevent voltage spikes and surges.
  • The recommended soldering conditions for the STPS16150CT involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and ensuring the device is not exposed to temperatures above 300°C (572°F) during the soldering process.

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STPS16150CT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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