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STPS16H100CG-TR - STMicroelectronics

Description: 100 V, 16 A dual Power Schottky Rectifier

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STPS16H100CG-TR - STMicroelectronics PCB footprint - Other - Other - STPS16H100CG-TR-2
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STPS16H100CG-TR Details

  • Manufacturer Part Number:

    STPS16H100CG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.22

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.88 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    3.6 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS16H100CG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, placing vias under the device can help to dissipate heat more efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Ensure good thermal design, use a heat sink if necessary, and avoid overheating the device. Also, consider using a thermistor or a thermal sensor to monitor the temperature and take corrective action if necessary.
  • To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-protected environment, use ESD-protected workbenches, and wear ESD-protective wrist straps or clothing. Ensure that all equipment and tools are properly grounded, and avoid touching the device's pins or leads with bare hands.
  • The optimal gate resistor value depends on the specific application, including the switching frequency, voltage, and current. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or seek guidance from STMicroelectronics' technical support team for a more accurate calculation.
  • The recommended soldering conditions for the STPS16H100CG-TR include a peak temperature of 260°C, a soldering time of 10 seconds, and a preheating temperature of 120°C to 150°C. It's essential to follow the recommended soldering profile to prevent damage to the device.

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STPS16H100CG-TR Overview

Use the download button to access the STPS16H100CG-TR schematic symbol and PCB footprint.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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