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STPS1L20M - STMicroelectronics

Description: 20 V, 1 A STmite Low Drop Power Schottky Rectifier,Tj (max):150°C,VF(max):0.37 V.

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STPS1L20M - STMicroelectronics PCB footprint - Other - Other - STPS1L20M
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STPS1L20M Details

  • Manufacturer Part Number:

    STPS1L20M

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-216AA

  • Package Description:

    ST MITE PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JEDEC-95 Code:

    DO-216AA

  • JESD-30 Code:

    S-PSSO-G1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS1L20M Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of any components or copper traces.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and place the device on the PCB. Use a reflow oven or a hot air gun to solder the device. Avoid overheating the device, and ensure the solder joints are clean and free of oxidation.
  • Handle the device by the body, not the leads. Avoid touching the leads or the die, as the oils from human skin can cause electrical leakage. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Store the device in an anti-static bag or wrap it in anti-static foam when not in use.
  • The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Ensure the calculated power dissipation is within the device's specified limits to prevent overheating.
  • The recommended input capacitor is a 10uF to 22uF X7R or X5R ceramic capacitor, and the recommended output capacitor is a 10uF to 22uF X7R or X5R ceramic capacitor. The capacitor values may vary depending on the specific application and operating conditions. Consult the datasheet and application notes for more information.

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STPS1L20M Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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