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STPS1L40M - STMicroelectronics

Description: STMICROELECTRONICS - STPS1L40M - SCHOTTKY RECTIFIER, 1A, 40V, DO-216AA

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STPS1L40M - STMicroelectronics PCB footprint - Other - Other - STmite_1
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STPS1L40M - STMicroelectronics  - 3D model - Other - STmite_1
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STPS1L40M Details

  • Manufacturer Part Number:

    STPS1L40M

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-216AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JEDEC-95 Code:

    DO-216AA

  • JESD-30 Code:

    S-PSSO-G1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    63 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS1L40M Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS1L40M). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
  • The recommended soldering conditions for the STPS1L40M are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/s. Ensure that the device is handled and stored in accordance with the recommended moisture sensitivity level (MSL) of 3.
  • To protect the STPS1L40M from ESD, handle the device in an ESD-protected environment, use ESD-protective packaging and storage materials, and ensure that all personnel handling the device are grounded. Use an ESD wrist strap or mat, and avoid touching the device's pins or leads.
  • The recommended storage conditions for the STPS1L40M are: temperature range of -40°C to 150°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, ESD-protected environment.

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STPS1L40M Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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