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STPS20120CTN - STMicroelectronics

Description: Power Schottky rectifier

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STPS20120CTN - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB narrow
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STPS20120CTN - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220AB narrow
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STPS20120CTN Details

  • Manufacturer Part Number:

    STPS20120CTN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.02 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS20120CTN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STPS20120CTN is -40°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure proper soldering and assembly techniques. Additionally, consider using a thermally conductive pad or heat sink to dissipate heat.
  • Use a multi-layer PCB with a solid ground plane, and ensure a minimum of 2 oz copper thickness. Place thermal vias under the device to dissipate heat. A heat sink or thermal pad can also be used to improve thermal performance.
  • Use a PCB with a sufficient current-carrying capacity, and ensure that the traces and vias are designed to handle the maximum current rating. Consider using a current sense resistor to monitor current flow.
  • The STPS20120CTN has built-in ESD protection. However, it's still important to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges.

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STPS20120CTN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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