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STPS20H100CG-TR - STMicroelectronics

Description: Rectifier Diode Schottky 100V 20A 3-Pin(2+Tab) D2PAK T/R

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STPS20H100CG-TR - STMicroelectronics PCB footprint - Other - Other - STPS20H100CG-TR-1
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STPS20H100CG-TR - STMicroelectronics  - 3D model - Other - STPS20H100CG-TR-1
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STPS20H100CG-TR Details

  • Manufacturer Part Number:

    STPS20H100CG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.38

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.88 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    4.5 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS20H100CG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a thermal via array can also help to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal management, use a suitable heat sink, and avoid overheating the device.
  • To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-protected environment, use ESD-protected workbenches and tools, and ensure that your body and clothing are properly grounded. Avoid touching the device's pins or leads, and use anti-static packaging and storage materials.
  • When selecting an input capacitor, consider the device's input capacitance requirements, the operating frequency, and the desired ripple voltage. A general rule of thumb is to choose a capacitor with a capacitance value between 1-10 μF, and a voltage rating that exceeds the maximum input voltage.
  • To minimize EMI, follow good PCB design practices, such as keeping the device's switching nodes away from sensitive analog circuits, using a solid ground plane, and minimizing loop areas. Additionally, use shielding, filtering, and decoupling capacitors to reduce EMI emissions.

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STPS20H100CG-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 100V V(RRM), Silicon