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STPS20L45CG-TR - STMicroelectronics

Description: 45 V, 20 A dual Low Drop Power Schottky Rectifier,VF (typ.):0.44 V,Tj (max.):150 °C.D²PAK.

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STPS20L45CG-TR - STMicroelectronics PCB footprint - Other - Other - STPS20L45CG-TR
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STPS20L45CG-TR Details

  • Manufacturer Part Number:

    STPS20L45CG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.32

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.73 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS20L45CG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS20L45CG-TR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (Tj) and adjust the operating conditions accordingly.
  • The recommended soldering conditions for the STPS20L45CG-TR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. Use a soldering iron with a temperature range of 200-240°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
  • To handle ESD protection for the STPS20L45CG-TR, ensure that all personnel handling the device wear ESD-protective wrist straps or use ESD-protective mats. Use ESD-protective packaging and storage materials, and avoid touching the device's pins or leads. Implement ESD protection circuits in the system design, such as TVS diodes or ESD protection arrays.
  • The recommended storage conditions for the STPS20L45CG-TR are: temperature range of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, clean environment, and avoid exposing it to chemicals or contaminants.

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STPS20L45CG-TR Overview

Use the download button to access the STPS20L45CG-TR schematic symbol and PCB footprint.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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