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STPS2150AFN - STMicroelectronics

Description: Schottky Diodes & Rectifiers 150 V, 2 A Power Schottky Rectifier

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STPS2150AFN - STMicroelectronics - PCB symbol
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STPS2150AFN - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - STPS1L40AFN
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STPS2150AFN - STMicroelectronics - 3D model - Small Outline Diode Flat Lead - STPS1L40AFN
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STPS2150AFN Details

  • Manufacturer Part Number:

    STPS2150AFN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2019-09-30

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    70 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    1.5 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS2150AFN Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS2150AFN). Use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Also, ensure that the device is not subjected to thermal shocks or rapid temperature changes.
  • The recommended soldering conditions for the STPS2150AFN are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. It is also recommended to use a soldering iron with a temperature control, and to avoid applying excessive force or pressure during soldering.
  • During storage and shipping, the STPS2150AFN should be stored in its original packaging or in a similar anti-static package. The device should be protected from electrostatic discharge (ESD) and physical damage. Avoid exposing the device to high temperatures, humidity, or physical stress.
  • The recommended electrical connections for the STPS2150AFN involve connecting the drain (D) pin to the load, the source (S) pin to the ground, and the gate (G) pin to a suitable gate driver or controller. Ensure that the device is connected correctly to avoid electrical overstress or damage.

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STPS2150AFN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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