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STPS30150CT - STMicroelectronics

Description: High voltage power Schottky rectifier

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STPS30150CT - STMicroelectronics - PCB symbol
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PCB Footprints
STPS30150CT - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB-ren6
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3D Models
STPS30150CT - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB-ren6
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STPS30150CT Details

  • Manufacturer Part Number:

    STPS30150CT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220AB, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.82

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    220 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    6.5 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS30150CT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a heat sink or thermal pad, and avoid overheating the device by monitoring the junction temperature.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ground yourself before handling the device. Avoid touching the device's pins or leads, and use an anti-static wrist strap or mat.
  • To calculate the power dissipation of the device, use the formula Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • The recommended input and output capacitors for optimal performance are ceramic capacitors with a value of 10uF to 22uF, and a voltage rating of 50V or higher. The capacitors should be placed as close as possible to the device's input and output pins.

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STPS30150CT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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