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STPS30170DJF-TR - STMicroelectronics

Description: STMicroelectronics STPS30170DJF-TR, SMT Schottky Diode, 170V 30A, 12-Pin PowerFLAT

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PCB Footprints
STPS30170DJF-TR - STMicroelectronics PCB footprint - Other - Other - PowerFLAt5x6_1
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STPS30170DJF-TR - STMicroelectronics  - 3D model - Other - PowerFLAt5x6_1
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STPS30170DJF-TR Details

  • Manufacturer Part Number:

    STPS30170DJF-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    6 X 5 MM, ROHS COMPLIANT, PLASTIC, POWERFLAT-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.38

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    FAST RECOVERY POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    170 V

  • Reverse Current-Max:

    15 µA

  • Reverse Test Voltage:

    170 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS30170DJF-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other layers of the PCB.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal management, and consider derating the device's power handling capabilities at elevated temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range.
  • The STPS30170DJF-TR is a standard commercial-grade device, and it may not meet the requirements for high-reliability or safety-critical applications. It's recommended to consult with STMicroelectronics or a qualified reliability engineer to determine the device's suitability for such applications.
  • The STPS30170DJF-TR has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing, storage, and handling to prevent damage.

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STPS30170DJF-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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