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STPS3030CG - STMicroelectronics

Description: Low drop power Schottky rectifier D2PAK , 30V , 250A , 4100W , -65°C to +150°C

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PCB Footprints
STPS3030CG - STMicroelectronics PCB footprint - Other - Other - D2PAK_2026-2.3
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STPS3030CG Details

  • Manufacturer Part Number:

    STPS3030CG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.58 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS3030CG Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array underneath the package to ensure good heat dissipation. A thermal pad size of 3.5 mm x 3.5 mm is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, the device should be operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • The maximum allowed voltage on the input pins is 6 V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the input voltage within the specified range of 4.5 V to 5.5 V.
  • The STPS3030CG has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe equipment, wrist straps, and mats, as well as following proper grounding and shielding techniques.
  • The STPS3030CG is designed to operate at a frequency range of 100 kHz to 1 MHz. Operating the device outside of this range may affect its performance and reliability.

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STPS3030CG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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