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STPS30SM100SFP - STMicroelectronics

Description: 100 V, 30 A power Schottky rectifier

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STPS30SM100SFP - STMicroelectronics - PCB symbol
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STPS30SM100SFP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB
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STPS30SM100SFP - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB
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STPS30SM100SFP Details

  • Manufacturer Part Number:

    STPS30SM100SFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FPAB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    LOW FORWARD VOLTAGE

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    530 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    45 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS30SM100SFP Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5046, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet or the application note AN5046. Additionally, the thermal resistance (RthJA) and junction temperature (Tj) should be considered to ensure the device operates within the safe operating area.
  • The maximum allowed voltage ripple is not explicitly stated in the datasheet, but it's recommended to keep the input voltage ripple below 10% of the nominal input voltage and the output voltage ripple below 1% of the nominal output voltage to ensure stable operation and minimize electromagnetic interference (EMI).
  • Yes, the STPS30SM100SFP is qualified for automotive and high-reliability applications. It meets the AEC-Q100 qualification standard and is designed to operate in harsh environments. However, it's essential to follow the recommended design guidelines and testing procedures to ensure the device meets the specific application requirements.
  • To ensure EMC, follow the recommended PCB layout and design guidelines in the application note AN5046. Additionally, use proper shielding, filtering, and decoupling techniques to minimize electromagnetic interference (EMI) and ensure compliance with relevant EMC standards.

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STPS30SM100SFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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