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STPS30SM100SG-TR - STMicroelectronics

Description: STMicroelectronics STPS30SM100SG-TR, SMT Schottky Diode, 100V 30A, 3-Pin D2PAK

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STPS30SM100SG-TR - STMicroelectronics - PCB symbol
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PCB Footprints
STPS30SM100SG-TR - STMicroelectronics PCB footprint - Other - Other - STPS10150CG-TR-2
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STPS30SM100SG-TR - STMicroelectronics - 3D model - Other - STPS10150CG-TR-2
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STPS30SM100SG-TR Details

  • Manufacturer Part Number:

    STPS30SM100SG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.38

  • Additional Feature:

    AVALANCHE RATED

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    45 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

STPS30SM100SG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a thermal via array can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using thermal interface materials and thermal pads to improve heat transfer.
  • For EMI and RFI shielding, consider using a metal shield or a Faraday cage around the device, and ensure good grounding of the shield. Also, use a low-pass filter or a ferrite bead to filter out high-frequency noise on the input lines.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the input voltage is within the recommended range, and that the output voltage is within the specified tolerance. Also, check for any signs of overheating or excessive current draw.
  • To prevent damage, store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static wrist straps or mats when handling the device to prevent electrostatic discharge.

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STPS30SM100SG-TR Overview

Use the download button to access the STPS30SM100SG-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STPS3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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