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STPS30SM100SR - STMicroelectronics

Description: 100 V, 30 A power Schottky rectifier Operating Temperature - Junction 150°C (Max)

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STPS30SM100SR - STMicroelectronics PCB footprint - Other - Other - I²PAK
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STPS30SM100SR - STMicroelectronics  - 3D model - Other - I²PAK
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STPS30SM100SR Details

  • Manufacturer Part Number:

    STPS30SM100SR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    I2PAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JESD-30 Code:

    R-PSIP-T3

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    45 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS30SM100SR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure optimal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device, ensure proper thermal management, and consider using a thermally conductive interface material (TCIM) to improve heat transfer between the device and the heat sink.
  • Using a different heat sink material or size can affect the thermal performance of the device. A larger heat sink with a higher thermal conductivity can improve thermal performance, but may also increase cost and size. It's essential to simulate and validate the thermal performance of the system using tools like thermal simulation software or thermal network analysis.
  • STMicroelectronics recommends following their guidelines for EOS and ESD protection, which include using TVS diodes, resistors, and capacitors to protect the device from voltage transients and electrostatic discharges. Additionally, proper handling and storage procedures should be followed to prevent ESD damage.
  • Schottky diodes have a lower forward voltage drop and faster switching times compared to standard diodes, which can improve efficiency and reduce power losses. However, Schottky diodes may have a higher leakage current and be more sensitive to voltage transients. The choice between a Schottky diode and a standard diode depends on the specific application requirements and trade-offs.

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STPS30SM100SR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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