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STPS30SM100ST - STMicroelectronics

Description: 100 V, 30 A 3-lead single Low Leakage Power Schottky rectifier

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STPS30SM100ST - STMicroelectronics - PCB symbol
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PCB Footprints
STPS30SM100ST - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB_2022
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3D Models
STPS30SM100ST - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB_2022
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STPS30SM100ST Details

  • Manufacturer Part Number:

    STPS30SM100ST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220AB, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.82

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    45 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS30SM100ST Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • When paralleling multiple STPS30SM100ST devices, it's crucial to ensure that the devices are properly synchronized, the current sharing is balanced, and the thermal management is adequate to prevent hotspots and ensure reliable operation.
  • To protect the device from overvoltage and overcurrent conditions, consider using overvoltage protection (OVP) and overcurrent protection (OCP) circuits, and ensure that the device is operated within the recommended specifications.
  • The recommended soldering and assembly techniques for the STPS30SM100ST involve using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended reflow soldering profile to prevent damage to the device.

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STPS30SM100ST Overview

Use the download button to access the STPS30SM100ST schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STPS3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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