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STPS30SM120SFP - STMicroelectronics

Description: STMICROELECTRONICS - STPS30SM120SFP - SCHOTTKY RECT, SINGLE, 120V, TO-220FPAB

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STPS30SM120SFP - STMicroelectronics - PCB symbol
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PCB Footprints
STPS30SM120SFP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220-FP
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3D Models
STPS30SM120SFP - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220-FP
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STPS30SM120SFP Details

  • Manufacturer Part Number:

    STPS30SM120SFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220FPAB, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.82

  • Additional Feature:

    LOW FORWARD VOLTAGE

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    275 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS30SM120SFP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STPS30SM120SFP is -40°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure proper soldering and assembly techniques. Additionally, consider using a thermally conductive interface material to improve heat dissipation.
  • A recommended PCB layout includes a thermal pad connected to a large copper area for heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. Ensure good airflow and avoid thermal hotspots.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper handling and storage procedures. Ground yourself before handling the device, and use an ESD wrist strap or mat.
  • Use a soldering temperature of 260°C (max) for 10 seconds (max) to avoid damaging the device. Ensure proper soldering techniques and use a solder with a melting point above 217°C.

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STPS30SM120SFP Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like STPS3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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