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STPS3170AFN - STMicroelectronics

Description: Schottky Diodes & Rectifiers DFD THYR TRIAC & RECTIFIER

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STPS3170AFN - STMicroelectronics - PCB symbol
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STPS3170AFN - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - STPS3170AFN
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STPS3170AFN - STMicroelectronics - 3D model - Small Outline Diode Flat Lead - STPS3170AFN
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STPS3170AFN Details

  • Manufacturer Part Number:

    STPS3170AFN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    170 V

  • Reverse Current-Max:

    4 µA

  • Reverse Test Voltage:

    170 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS3170AFN Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 150°C). Implement proper thermal management, such as heat sinks or thermal interfaces, to keep the device temperature below 125°C. Also, ensure that the PCB is designed to withstand high temperatures and that the device is properly soldered.
  • The recommended soldering conditions for the STPS3170AFN are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature slope of 3°C/s. Ensure that the PCB is designed to withstand these soldering conditions, and that the device is properly cleaned and dried before soldering.
  • To protect the device from electrostatic discharge (ESD), ensure that all personnel handling the device wear anti-static wrist straps or use anti-static mats. Use ESD-protected packaging and storage materials, and ensure that the device is properly grounded during handling and assembly. Implement ESD protection circuits in the system design, such as TVS diodes or ESD protection arrays.
  • The recommended input and output capacitors for the STPS3170AFN are X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. The input capacitor should be 1-10uF, and the output capacitor should be 1-22uF. Ensure that the capacitors are placed close to the device and have low equivalent series resistance (ESR) and inductance (ESL).

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STPS3170AFN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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