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STPS3170UF - STMicroelectronics

Description: 170 V, 3 A power Schottky rectifier

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STPS3170UF - STMicroelectronics - PCB symbol
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PCB Footprints
STPS3170UF - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SMBFLAT
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3D Models
STPS3170UF - STMicroelectronics - 3D model - Small Outline Diode Flat Lead - SMBFLAT
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STPS3170UF Details

  • Manufacturer Part Number:

    STPS3170UF

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Manufacturer Package Code:

    SMBFlat

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.22

  • Additional Feature:

    LOW LEAKAGE CURRENT, FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    170 V

  • Reverse Current-Max:

    4 µA

  • Reverse Test Voltage:

    170 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

STPS3170UF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a suitable heat sink, and follow proper PCB design and layout guidelines for thermal management.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and storage procedures.
  • Select input and output capacitors based on the device's recommended capacitance values, voltage ratings, and ESR (Equivalent Series Resistance) requirements, and ensure that they meet the device's operating frequency and ripple current requirements.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering components as needed, and ensure that the device is operated within the recommended frequency range and with proper decoupling.

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STPS3170UF Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like STPS3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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