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STPS3H100AFY - STMicroelectronics

Description: STMICROELECTRONICS - STPS3H100AFY - SCHOTTKY RECT, AEC-Q101, 100V, SOD-128FL

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STPS3H100AFY - STMicroelectronics - PCB symbol
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PCB Footprints
STPS3H100AFY - STMicroelectronics PCB footprint - Other - Other - SOD128FLAT
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3D Models
STPS3H100AFY - STMicroelectronics - 3D model - Other - SOD128FLAT
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STPS3H100AFY Details

  • Manufacturer Part Number:

    STPS3H100AFY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD128, 2 PIN

  • Manufacturer Package Code:

    SOD128-Flat NEP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    HIGH VOLTAGE POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    1.5 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

STPS3H100AFY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS3H100AFY). Use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Also, ensure that the device is not subjected to thermal shocks or rapid temperature changes.
  • The recommended soldering conditions for the STPS3H100AFY are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. It is also recommended to use a soldering iron with a temperature control, and to avoid applying excessive force or pressure during soldering.
  • During storage and shipping, the device should be stored in its original packaging or in a similar protective package. The device should be protected from moisture, dust, and physical damage. Avoid exposing the device to extreme temperatures, humidity, or physical stress.
  • The STPS3H100AFY is a sensitive device and requires proper ESD protection during handling and assembly. It is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads, rather than the pins. Avoid touching the pins or exposing the device to static electricity.

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STPS3H100AFY Overview

Use the download button to access the STPS3H100AFY schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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