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STPS41H100CT - STMicroelectronics

Description: Rectifier Diode Schottky 100V 40A 3-Pin(3+Tab) TO-220AB Tube

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STPS41H100CT - STMicroelectronics - PCB symbol
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PCB Footprints
STPS41H100CT - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB_2022
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3D Models
STPS41H100CT - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB_2022
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STPS41H100CT Details

  • Manufacturer Part Number:

    STPS41H100CT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.82

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    220 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS41H100CT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a thermal via array can also help to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal design, use a heat sink if necessary, and consider using a thermal interface material to improve heat transfer.
  • To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage materials.
  • To calculate the power dissipation, you need to know the device's voltage drop (Vf) and current (If) ratings. Use the formula: Pd = Vf x If. You can find the Vf and If values in the datasheet. Consider the device's thermal resistance (Rth) and the ambient temperature (Ta) to estimate the junction temperature (Tj).
  • The recommended soldering conditions for the STPS41H100CT are: peak temperature of 260°C, soldering time of 10 seconds, and a temperature slope of 3°C/s. Ensure that the soldering process is lead-free and RoHS-compliant.

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STPS41H100CT Overview

Use the download button to access the STPS41H100CT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STPS4, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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