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STPS50U100CR - STMicroelectronics

Description: ULVF™ power Schottky rectifier

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STPS50U100CR - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - I2PAK
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STPS50U100CR - STMicroelectronics  - 3D model - Transistor Outline, Vertical - I2PAK
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STPS50U100CR Details

  • Manufacturer Part Number:

    STPS50U100CR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    I2PAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS50U100CR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STPS50U100CR is -40°C to 150°C, as specified in the datasheet. However, it's recommended to derate the power dissipation above 125°C to ensure reliable operation.
  • To calculate the power dissipation of the STPS50U100CR, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance. The formula is: Pd = (Vin - Vout) x Iout x RthJA, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, Iout is the output current, and RthJA is the thermal resistance from junction to ambient.
  • For optimal thermal performance, it's recommended to use a PCB layout with a large copper area connected to the tab of the device, and to ensure good thermal conduction to the ambient air. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate to dissipate heat efficiently.
  • Yes, the STPS50U100CR is a high-reliability device that meets the requirements of the automotive and aerospace industries. It's qualified according to the AEC-Q101 standard for automotive applications and is also suitable for aerospace applications due to its high temperature rating and low failure rate.
  • To protect the STPS50U100CR from overvoltage and overcurrent conditions, you can use a combination of voltage regulators, current limiters, and fuses. Additionally, you can implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits using external components, such as zener diodes and resistors.

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STPS50U100CR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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