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STPS50U100CT - STMicroelectronics

Description: ULVF™ power Schottky rectifier

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STPS50U100CT - STMicroelectronics - PCB symbol
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PCB Footprints
STPS50U100CT - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB
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3D Models
STPS50U100CT - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB
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STPS50U100CT Details

  • Manufacturer Part Number:

    STPS50U100CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.73 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS50U100CT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STPS50U100CT is -40°C to 150°C, as specified in the datasheet. However, it's recommended to derate the power dissipation above 125°C to ensure reliable operation.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink and thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to dissipate the maximum power dissipation of the device, and the TIM should have a thermal conductivity of at least 5 W/mK.
  • The recommended PCB layout for the STPS50U100CT involves placing the device on a multi-layer board with a solid ground plane and a separate power plane. The device should be placed near the edge of the board to facilitate heat dissipation, and the input and output pins should be routed away from each other to minimize electromagnetic interference (EMI).
  • Yes, the STPS50U100CT is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems. However, it's essential to follow the recommended operating conditions, derating, and qualification guidelines to ensure the device meets the required reliability standards.
  • To protect the STPS50U100CT from overvoltage and overcurrent, it's recommended to use a voltage regulator or a DC-DC converter with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, a fuse or a current-limiting resistor can be used to prevent excessive current from flowing through the device.

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STPS50U100CT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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