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STPS5H100B-TR - STMicroelectronics

Description: Diode 100 V 5A Surface Mount DPAK

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STPS5H100B-TR - STMicroelectronics - PCB symbol
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STPS5H100B-TR - STMicroelectronics PCB footprint - Other - Other - DPAK_18
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STPS5H100B-TR - STMicroelectronics - 3D model - Other - DPAK_18
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STPS5H100B-TR Details

  • Manufacturer Part Number:

    STPS5H100B-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    DPAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.22

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    3.5 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

STPS5H100B-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS5H100B-TR). Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Avoid overheating, which can cause permanent damage to the device.
  • When handling the STPS5H100B-TR, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads. Avoid touching the device's pins or leads, and store the device in an anti-static bag or container.
  • To calculate the power dissipation of the STPS5H100B-TR, use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Ensure that the calculated power dissipation is within the device's recommended maximum power dissipation rating.
  • The recommended input and output capacitors for the STPS5H100B-TR are ceramic capacitors with a voltage rating of at least 2x the input voltage. A 10uF to 22uF input capacitor and a 10uF to 47uF output capacitor are recommended. Ensure that the capacitors are placed close to the device and have low ESR (Equivalent Series Resistance) for optimal performance.

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STPS5H100B-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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