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STPS6045CW - STMicroelectronics

Description: Dual Schottky barrier diode,STPS6045CW STMicroelectronics STPS6045CW, Dual Schottky Diode, Common Cathode, 45V 60A, 3-Pin TO-247

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PCB Footprints
STPS6045CW - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-4
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3D Models
STPS6045CW - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-247-4
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STPS6045CW Details

  • Manufacturer Part Number:

    STPS6045CW

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247AC

  • Package Description:

    TO-247LL, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.7

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    FAST RECOVERY POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS6045CW Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or thermal pad to dissipate heat efficiently.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ground yourself before handling the device. Avoid touching the device's pins or leads, and use an anti-static wrist strap or mat when handling the device.
  • To calculate the power dissipation of the device, use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Consider the device's efficiency, input voltage, and output current to estimate the power dissipation.
  • When selecting input and output capacitors, consider the capacitor's voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a voltage rating higher than the maximum input voltage, and ensure the capacitance value is sufficient to filter out ripple and noise. Low ESR capacitors are recommended to minimize power losses.

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STPS6045CW Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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