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STPS80150CW - STMicroelectronics

Description: 150 V power Schottky rectifier

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Symbol
STPS80150CW - STMicroelectronics - PCB symbol
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PCB Footprints
STPS80150CW - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-4
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3D Models
STPS80150CW - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-247-4
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STPS80150CW Details

  • Manufacturer Part Number:

    STPS80150CW

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247AD

  • Package Description:

    TO-247LL, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE POWER

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.96 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    40 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS80150CW Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or thermal pad to dissipate heat efficiently.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ground yourself before handling the device. Avoid touching the device's pins or leads, and use an anti-static wrist strap or mat when handling the device.
  • To calculate the power dissipation of the device, you need to consider the input voltage, output voltage, output current, and the device's efficiency. Use the datasheet's power dissipation formula and consult the application notes for guidance on calculating power dissipation in your specific application.
  • The recommended soldering conditions for the STPS80150CW involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and ensuring that the device is not exposed to temperatures above 260°C (500°F) for more than 10 seconds.

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STPS80150CW Overview

Use the download button to access the STPS80150CW schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STPS8, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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