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STPS80170CWLY - STMicroelectronics

Description: Automotive 170 V, 80A, low drop power Schottky rectifier

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STPS80170CWLY - STMicroelectronics - PCB symbol
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PCB Footprints
STPS80170CWLY - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 long leads
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3D Models
STPS80170CWLY - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-247 long leads
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STPS80170CWLY Details

  • Manufacturer Part Number:

    STPS80170CWLY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247LL, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    45 Weeks

  • Date Of Intro:

    2019-12-02

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.96 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    40 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    170 V

  • Reverse Current-Max:

    80 µA

  • Reverse Test Voltage:

    170 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS80170CWLY Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5046, which includes guidelines for thermal pad connection, copper thickness, and via placement to ensure optimal thermal performance.
  • The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet's efficiency vs. output current graph. Additionally, the junction-to-ambient thermal resistance (RthJA) should be considered to ensure the device operates within the recommended temperature range.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • The STPS80170CWLY is rated for operation up to 150°C, but the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal design and ensure the device operates within the recommended temperature range to maintain its performance and lifespan.
  • STMicroelectronics provides a recommended soldering profile in the datasheet. It's essential to follow the recommended soldering temperature and time to prevent damage to the device. Additionally, ensure the device is properly connected to the PCB, and the thermal pad is connected to a solid copper plane to ensure optimal thermal performance.

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STPS80170CWLY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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