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STPSC10H12B2-TR - STMicroelectronics

Description: 1200 V, 10 A, silicon carbide power Schottky diode

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STPSC10H12B2-TR - STMicroelectronics PCB footprint - Other - Other - STPSC10H12B2-TR
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STPSC10H12B2-TR Details

  • Manufacturer Part Number:

    STPSC10H12B2-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2020-10-07

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    HIGH VOLTAGE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    71 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    60 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

STPSC10H12B2-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component away from other heat sources and using a heat sink can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities. Additionally, using a heat sink and ensuring good airflow can also help to reduce the junction temperature.
  • The STPSC10H12B2-TR has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, it's recommended to use a latch-up immune design, and to ensure that the device is operated within the recommended operating conditions.
  • The gate resistor value depends on the specific application requirements, such as the switching frequency, gate drive voltage, and the device's gate capacitance. A general guideline is to use a value between 10 ohms to 100 ohms, but it's recommended to consult the application note and perform simulations to determine the optimal value.
  • When paralleling multiple devices, it's essential to ensure that the devices are properly matched, and that the gate drive signals are synchronized. Additionally, the PCB layout should be designed to minimize inductance and ensure good thermal performance. It's also recommended to consult the application note and perform simulations to determine the optimal configuration.

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STPSC10H12B2-TR Overview

Use the download button to access the STPSC10H12B2-TR schematic symbol and PCB footprint.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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