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STPSC10H12G2Y-TR - STMicroelectronics

Description: Automotive Grade 1200V, 10A, silicon carbide power Schottky Diode

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STPSC10H12G2Y-TR - STMicroelectronics - PCB symbol
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STPSC10H12G2Y-TR - STMicroelectronics PCB footprint - Other - Other - STPSC10H12G2Y-TR-3
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STPSC10H12G2Y-TR Details

  • Manufacturer Part Number:

    STPSC10H12G2Y-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.75

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    71 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    60 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPSC10H12G2Y-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the device to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure that the device is properly cooled, and the thermal pad is properly soldered to the PCB.
  • The STPSC10H12G2Y-TR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • To troubleshoot issues with the output voltage regulation, check the input voltage, output voltage, and feedback resistors. Ensure that the feedback resistors are correctly selected and that the output voltage is within the specified range. Also, check for any signs of overheating or excessive current draw.
  • For PCB assembly and soldering, follow the recommended reflow soldering profile, and ensure that the device is properly aligned on the PCB. Use a solder paste with a high melting point, and avoid excessive soldering temperatures to prevent damage to the device.

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STPSC10H12G2Y-TR Overview

Use the download button to access the STPSC10H12G2Y-TR schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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