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STPSC606G-TR - STMicroelectronics

Description: STMicroelectronics STPSC606G-TR, SMT SiC Schottky Diode, 600V 6A, 3-Pin D2PAK

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STPSC606G-TR - STMicroelectronics - PCB symbol
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STPSC606G-TR - STMicroelectronics PCB footprint - Other - Other - STPSC606G-TR-2
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STPSC606G-TR Details

  • Manufacturer Part Number:

    STPSC606G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    27 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    75 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPSC606G-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended for optimal thermal performance. The PCB should also have a large copper area for heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the PCB is designed to minimize thermal resistance.
  • A ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 25V or higher is recommended. The capacitor should be placed as close to the device as possible to minimize ESR and ESL.
  • Use a TVS diode or a zener diode to protect the device from overvoltage. A fuse or a PTC resettable fuse can be used to protect the device from overcurrent. Additionally, ensure that the device is operated within the recommended voltage and current ratings.
  • A soldering profile with a peak temperature of 260°C to 280°C and a dwell time of 30 seconds to 60 seconds is recommended. The device should be soldered using a reflow soldering process.

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STPSC606G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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