STPSC6H065B-TR footprint, schematic symbol and 3D model by STMicroelectronics

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STPSC6H065B-TR - STMicroelectronics PCB footprint - Other - Other - STPSC6H065B-TR-2

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Stock & Prices Price & Stock for STPSC6H065B-TR
Part Number STPSC6H065B-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Schottky Diode with NC
Package Category Other
Footprint Name Other - STPSC6H065B-TR-2
Released Date Aug 29, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STPSC6H065B-TR Details

Manufacturer Part Number:
STPSC6H065B-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
DPAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
19 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6
Application:
POWER
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON CARBIDE
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.75 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
60 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
6 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Rep Pk Reverse Voltage-Max:
650 V
Reverse Current-Max:
60 µA
Reverse Test Voltage:
650 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

STPSC6H065B-TR Frequently Asked Questions (FAQs)

A good thermal design should be used to ensure optimal heat dissipation. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB, and multiple vias should be used to dissipate heat to the other side of the board.
To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, a good thermal design and a reliable cooling system should be implemented.
The STPSC6H065B-TR has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Latch-up prevention can be achieved by following proper design and layout guidelines, such as separating analog and digital circuits and using guard rings.
The gate resistor value depends on the specific application and the required switching frequency. A general guideline is to use a value between 10 ohms and 100 ohms. However, it is recommended to consult the application note and perform simulations to determine the optimal value for the specific design.
The device should be stored in a dry, cool place, away from direct sunlight and moisture. It should be handled with care to prevent mechanical stress, and ESD precautions should be taken during handling and assembly.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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