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STPSC8TH13TI - STMicroelectronics

Description: 2 x 650V tandem, 8 A High Surge Silicon Carbide Power Schottky Diode

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STPSC8TH13TI - STMicroelectronics - PCB symbol
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PCB Footprints
STPSC8TH13TI - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB-ren6
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3D Models
STPSC8TH13TI - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB-ren6
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STPSC8TH13TI Details

  • Manufacturer Part Number:

    STPSC8TH13TI

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.42

  • Application:

    POWER

  • Case Connection:

    ISOLATED

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    69 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    80 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPSC8TH13TI Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Monitor the device's thermal status using the thermal monitoring pin (THERMAL_PIN).
  • A minimum of 10uF ceramic capacitor with a low ESR (Equivalent Series Resistance) is recommended for input decoupling. Place the capacitor as close to the device as possible.
  • Enable the low-power mode (LP_MODE) and adjust the switching frequency (SW_FREQ) to minimize power losses. Use a high-efficiency inductor and optimize the PCB layout for minimal parasitic inductance.
  • A minimum of 22uF ceramic capacitor with a low ESR is recommended for output decoupling. Place the capacitor as close to the output pin as possible.

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STPSC8TH13TI Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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