STR755FR2H6 - STMicroelectronics

STR755FR2H6 Details

• Manufacturer Part Number:

  STR755FR2H6

• Brand Name:

  STMicroelectronics

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  8 X 8 MM. 1.70 MM HEIGHT, ROHS COMPLIANT, LFBGA-64

• Pin Count:

  64

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.25

• Manufacturer:

  STMicroelectronics

• YTEOL:

  0

• Has ADC:

  YES

• Additional Feature:

  ALSO OPERATES AT 3V MINIMUM SUPPLY

• Bit Size:

  32

• Boundary Scan:

  NO

• CPU Family:

  ARM7

• Clock Frequency-Max:

  60 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B64

• JESD-609 Code:

  e1

• Length:

  8 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  38

• Number of Terminals:

  64

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA64,8X8,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  16384

• ROM (words):

  262144

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.7 mm

• Speed:

  48 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  8 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC