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STTH1002CR - STMicroelectronics

Description: Diode Array 1 Pair Common Cathode Standard 200 V 8A Through Hole TO-262-3 Long Leads, I²Pak, TO-262AA

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STTH1002CR - STMicroelectronics PCB footprint - Other - Other - STTH1002CR-2
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STTH1002CR - STMicroelectronics  - 3D model - Other - STTH1002CR-2
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STTH1002CR Details

  • Manufacturer Part Number:

    STTH1002CR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, I2PAK-3

  • Pin Count:

    3

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    4.52

  • Application:

    EFFICIENCY

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH1002CR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended derating curves for voltage and current, and to ensure that the device is properly cooled. Additionally, the device should be operated within the recommended junction temperature range of -40°C to 150°C.
  • STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s. It is essential to follow the recommended soldering profile to prevent damage to the device.
  • To protect the device from ESD, it is essential to handle the device with anti-static precautions, such as using an anti-static wrist strap or mat. The device should also be stored in an anti-static bag or container when not in use.
  • STMicroelectronics recommends storing the device in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The device should be stored in its original packaging or an anti-static bag to prevent damage.

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STTH1002CR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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