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STTH1512D - STMicroelectronics

Description: 1200 V ultrafast recovery diode 15A,-65 to + 175 °C,TO-220AC

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STTH1512D - STMicroelectronics - PCB symbol
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PCB Footprints
STTH1512D - STMicroelectronics PCB footprint - Other - Other - TO-220AC_2026-1.5
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3D Models
STTH1512D - STMicroelectronics - 3D model - Other - TO-220AC_2026-1.5
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STTH1512D Details

  • Manufacturer Part Number:

    STTH1512D

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AC

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Recovery Time-Max:

    0.105 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH1512D Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current, and to ensure that the device is properly cooled. Additionally, the device should be operated within the recommended junction temperature range of -40°C to 150°C.
  • The maximum allowed voltage transient on the input pins is ±500mV, with a duration of less than 100ns. Exceeding this limit may cause damage to the device or affect its reliability.
  • To protect the device from ESD, it's recommended to follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, the device should be connected to a ground plane on the PCB to dissipate static charges.
  • STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s. The device should be soldered using a lead-free soldering process.

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STTH1512D Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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