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STTH1R06AF - STMicroelectronics

Description: 600 V, 1 A, turbo 2 ultrafast rectifier

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STTH1R06AF - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD128FLAT-
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3D Models
STTH1R06AF - STMicroelectronics  - 3D model - Small Outline Diode Flat Lead - SOD128FLAT-
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STTH1R06AF Details

  • Manufacturer Part Number:

    STTH1R06AF

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-128, 2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2019-04-03

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Additional Feature:

    LOW LEAKAGE CURRENT, LOW POWER LOSS

  • Application:

    ULTRA FAST RECOVERY POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.9 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    20 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.045 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

STTH1R06AF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STTH1R06AF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface materials, and airflow management.
  • The recommended PCB layout and thermal design for the STTH1R06AF involves using a multi-layer PCB with a solid ground plane, placing the device near a heat sink, and ensuring good thermal conductivity between the device and the heat sink.
  • To handle the high voltage and current ratings of the STTH1R06AF, ensure proper PCB design, use suitable components, and follow safe handling and assembly practices to prevent electrical overstress and damage.
  • To prevent ESD damage, handle the STTH1R06AF with ESD-protective equipment, wear an ESD wrist strap, and follow proper handling and storage procedures.

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STTH1R06AF Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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