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STTH2003CFP - STMicroelectronics

Description: Rectifier Diode Switching 300V 20A 35ns 3-Pin(3+Tab) TO-220FPAB Tube

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PCB Footprints
STTH2003CFP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FPB_1
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3D Models
STTH2003CFP - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220FPB_1
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STTH2003CFP Details

  • Manufacturer Part Number:

    STTH2003CFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FPAB, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.87

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    110 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STTH2003CFP Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, use a thermal interface material, and follow the recommended operating conditions and derating guidelines.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range.
  • To protect the device from ESD, handle the device by the body or use an anti-static wrist strap, use ESD-protected workstations, and ensure that the device is properly grounded during handling and assembly.
  • The recommended soldering conditions for the STTH2003CFP include a peak temperature of 260°C, a soldering time of 10 seconds, and a temperature ramp-up rate of 3°C/s.

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STTH2003CFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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