STTH20R04G-TR footprint, schematic symbol and 3D model by STMicroelectronics

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STTH20R04G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2022-10

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Part Number STTH20R04G-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D²PAK_2022-10
Released Date Aug 30, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH20R04G-TR Details

Manufacturer Part Number:
STTH20R04G-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-263
Package Description:
D2PAK-3/2
Pin Count:
2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
STMicroelectronics
YTEOL:
6.55
Additional Feature:
LOW LEAKAGE CURRENT
Application:
ULTRA FAST RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.7 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
150 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Output Current-Max:
20 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
400 V
Reverse Current-Max:
20 µA
Reverse Recovery Time-Max:
0.045 µs
Reverse Test Voltage:
400 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

STTH20R04G-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STTH20R04G-TR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good thermal contact. Also, consider using a thermocouple or temperature sensor to monitor the device temperature.
The recommended soldering conditions for the STTH20R04G-TR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. Use a soldering iron with a temperature range of 200-240°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
During storage and shipping, handle the device by the body, not the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and ensure that the device is not subjected to mechanical stress or vibration.
The STTH20R04G-TR is a sensitive device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device pins or leads, and use ESD-safe packaging materials.

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STTH20R04G-TR Overview

Use the download button to access the STTH20R04G-TR schematic symbol and PCB footprint.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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