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STTH3010D - STMicroelectronics

Description: Ultrafast recovery - high voltage diode

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STTH3010D - STMicroelectronics - PCB symbol
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PCB Footprints
STTH3010D - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC
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3D Models
STTH3010D - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AC
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STTH3010D Details

  • Manufacturer Part Number:

    STTH3010D

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.1 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH3010D Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or thermal pad to dissipate heat efficiently.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ground yourself before handling the device. Avoid touching the device's pins or leads, and use an anti-static wrist strap or mat when handling the device.
  • To calculate the power dissipation of the device, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance of the device and its environment. Use the datasheet values for thermal resistance and voltage drop, and consult application notes or STMicroelectronics' support resources for guidance.
  • The recommended soldering conditions for the STTH3010D involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. Ensure the device is not exposed to temperatures above 260°C, and follow the recommended soldering profile to prevent damage.

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STTH3010D Overview

Use the download button to access the STTH3010D schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STTH3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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