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STTH3010GY-TR - STMicroelectronics

Description: Diodes - General Purpose, Power, Switching Ultrafast Recovery 30A 1000V 1.30VF

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STTH3010GY-TR - STMicroelectronics PCB footprint - Other - Other - STTH3010GY-TR-2
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STTH3010GY-TR - STMicroelectronics  - 3D model - Other - STTH3010GY-TR-2
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STTH3010GY-TR Details

  • Manufacturer Part Number:

    STTH3010GY-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.62

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    15 µA

  • Reverse Recovery Time-Max:

    0.1 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STTH3010GY-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended for optimal thermal performance. The PCB should also have a large copper area for heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • The recommended soldering profile is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. The device should be soldered using a no-clean or water-soluble flux.
  • Handle the device by the body or pins, and avoid touching the die. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Use ESD-protected packaging and storage materials.
  • Store the device in a dry, cool place (TJ = 20°C to 30°C) with a relative humidity of 50% to 60%. Avoid storing the device in direct sunlight or near heat sources.

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STTH3010GY-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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