- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for STTH302S
- Part Number STTH302S
- Manufacturer STMicroelectronics
- Pin Count 2
- Part Category Diode
- Package Category Diodes Moulded Non Polarised
- Footprint Name Diodes Moulded Non Polarised - SMC (JEDEC DO-214AB)
- Released Date Sep 8, 2022
- Last Modified Date Jan 8, 2026 2:31 PM UTC
- Pinout / Pin List Click Here (Member Only)
STTH302S Details
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Manufacturer Part Number:
STTH302S
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Brand Name:
STMicroelectronics
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SMC, 2 PIN
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Pin Count:
2
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Factory Lead Time:
15 Weeks
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Manufacturer:
STMicroelectronics
STTH302S Frequently Asked Questions (FAQs)
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A good PCB layout for optimal thermal performance involves placing the STTH302S near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias or thermal pads under the device.
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To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
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For EMI and RFI shielding, ensure that the PCB layout is designed to minimize radiation and susceptibility. Use a metal shield or a Faraday cage to enclose the device, and ensure that all cables and connectors are properly shielded. Use EMI filters or common-mode chokes to reduce emissions.
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When selecting a heat sink for the STTH302S, consider the device's power dissipation, ambient temperature, and airflow. Choose a heat sink with a high thermal conductivity (e.g., copper or aluminum) and a suitable thermal interface material (TIM). Ensure the heat sink is properly mounted and secured to the device.
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For soldering and assembly, use a soldering iron with a temperature range of 200-250°C. Use a solder with a melting point above 180°C. Ensure the PCB is clean and dry before assembly. Use a reflow oven or a hot air soldering station for surface-mount devices. Follow the recommended soldering profile and avoid overheating the device.
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STTH302S Overview
Use the download button to access the STTH302S schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics
STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components.
STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut