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STTH30L06W - STMicroelectronics

Description: 30A 600V TURBO 2 Ultrafast High Voltage Rectifier

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STTH30L06W - STMicroelectronics - PCB symbol
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PCB Footprints
STTH30L06W - STMicroelectronics PCB footprint - Other - Other - DO-247 _2022
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3D Models
STTH30L06W - STMicroelectronics - 3D model - Other - DO-247 _2022
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STTH30L06W Details

  • Manufacturer Part Number:

    STTH30L06W

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-247

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    DO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    160 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Recovery Time-Max:

    0.09 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH30L06W Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STTH30L06W is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • A recommended PCB layout for the STTH30L06W includes using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
  • To calculate power dissipation, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance of the package. You can use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • When selecting a heat sink for the STTH30L06W, consider the device's power dissipation, the maximum operating temperature, and the thermal resistance of the heat sink. A heat sink with a low thermal resistance and a large surface area is recommended.

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STTH30L06W Overview

Use the download button to access the STTH30L06W schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STTH3, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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