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STTH30R03CG-TR - STMicroelectronics

Description: Diode Array 1 Pair Common Cathode 300 V 15A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB, -65°C ~ +175°C

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STTH30R03CG-TR - STMicroelectronics PCB footprint - Other - Other - D2PAK_2025-13
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STTH30R03CG-TR Details

  • Manufacturer Part Number:

    STTH30R03CG-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.55

  • Application:

    HYPER FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.9 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH30R03CG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias or thermal pads under the device.
  • To ensure accurate temperature measurements, calibrate the device using the calibration coefficients provided in the datasheet. Also, ensure that the device is not subject to thermal gradients or self-heating. Use a low-noise, low-impedance power supply, and avoid electromagnetic interference (EMI) near the device.
  • The maximum allowed voltage on the VDD pin is 3.6V. Exceeding this voltage may damage the device. It is recommended to use a voltage regulator or a voltage limiter to ensure that the voltage on the VDD pin does not exceed 3.6V.
  • The STTH30R03CG-TR can be interfaced with a microcontroller using the I2C bus. Connect the SCL pin to the microcontroller's clock pin, and the SDA pin to the microcontroller's data pin. Use a pull-up resistor on the SDA and SCL lines, and ensure that the microcontroller's I2C clock frequency is within the recommended range of 100 kHz to 400 kHz.
  • The typical current consumption of the STTH30R03CG-TR is 10 μA in normal operation mode, and 1 μA in low-power mode. However, the actual current consumption may vary depending on the operating conditions and the frequency of I2C transactions.

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STTH30R03CG-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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Part Image STTH30R03CG STMicroelectronics

Rectifier Diode, 1 Phase, 2 Element, 15A, 300V V(RRM), Silicon