STTH30RQ06G2-TR footprint, schematic symbol and 3D model by STMicroelectronics

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STTH30RQ06G2-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK HV

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Part Number STTH30RQ06G2-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D²PAK HV
Released Date Aug 31, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH30RQ06G2-TR Details

Manufacturer Part Number:
STTH30RQ06G2-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
D2PAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Date Of Intro:
2018-10-12
Manufacturer:
STMicroelectronics
YTEOL:
5.98
Additional Feature:
FREE WHEELING DIODE
Application:
HIGH VOLTAGE ULTRA FAST SOFT RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
2.95 V
JESD-30 Code:
R-PSSO-G2
Non-rep Pk Forward Current-Max:
180 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Output Current-Max:
30 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Rep Pk Reverse Voltage-Max:
600 V
Reverse Current-Max:
40 µA
Reverse Recovery Time-Max:
0.055 µs
Reverse Test Voltage:
600 V
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

STTH30RQ06G2-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. The device should be placed near the center of the PCB to minimize thermal resistance.
To ensure accurate temperature measurements, it's essential to follow proper PCB layout guidelines, minimize noise and interference, and use a low-noise power supply. Additionally, calibrate the device using the calibration coefficients provided in the datasheet, and consider using a temperature reference point for more accurate measurements.
The recommended power-up sequence is to first apply the analog power supply (VDDA) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent any potential latch-up conditions.
The STTH30RQ06G2-TR has an operating temperature range of -40°C to 125°C. To handle this limitation, ensure that the device is not exposed to temperatures outside this range during operation, storage, or transportation. Consider using thermal protection mechanisms, such as thermal shutdown or temperature monitoring, to prevent damage to the device.
The recommended method for soldering the STTH30RQ06G2-TR is to use a reflow soldering process with a peak temperature of 260°C for a maximum of 30 seconds. Hand soldering is not recommended due to the device's small size and thermal sensitivity.

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STTH30RQ06G2-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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