STTH30RQ06GY-TR footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

STTH30RQ06GY-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2022-3

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Part Number STTH30RQ06GY-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode with NC
Package Category Other
Footprint Name Other - D²PAK_2022-3
Released Date Aug 31, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH30RQ06GY-TR Details

Manufacturer Part Number:
STTH30RQ06GY-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
D2PAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.62
Additional Feature:
FREE WHEELING DIODE
Application:
HIGH VOLTAGE ULTRA FAST SOFT RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
2.95 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
180 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
30 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
600 V
Reverse Current-Max:
40 µA
Reverse Recovery Time-Max:
0.055 µs
Reverse Test Voltage:
600 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE

STTH30RQ06GY-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component placement and routing away from the thermal pad can help reduce thermal resistance.
To ensure reliable operation in high-humidity environments, it is recommended to apply a conformal coating to the device, and to follow proper PCB assembly and handling procedures to prevent moisture ingress. Additionally, the device should be stored in a dry environment before assembly.
The recommended soldering conditions for the STTH30RQ06GY-TR are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It is also recommended to use a soldering iron with a temperature control to prevent overheating.
To prevent damage during assembly, it is recommended to handle the device by the body, and to avoid touching the pins or the thermal pad. Additionally, the device should be stored in an anti-static bag or wrapped in anti-static material to prevent electrostatic discharge (ESD) damage.
The recommended thermal interface materials (TIMs) for the STTH30RQ06GY-TR are thermal greases or thermal tapes with a thermal conductivity of at least 1 W/m-K. Examples of suitable TIMs include Arctic Silver 5, Thermal Grizzly Kryonaut, and 3M Thermal Interface Material.

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STTH30RQ06GY-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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