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STTH30RQ06WL - STMicroelectronics

Description: 600 V, 30 A ultrafast high voltage rectifier

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PCB Footprints
STTH30RQ06WL - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - DO-247 LL
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3D Models
STTH30RQ06WL - STMicroelectronics  - 3D model - Transistor Outline, Vertical - DO-247 LL
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STTH30RQ06WL Details

  • Manufacturer Part Number:

    STTH30RQ06WL

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DO-247LL, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.95 V

  • JEDEC-95 Code:

    DO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    40 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH30RQ06WL Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-humidity environments, it is recommended to apply a conformal coating to the PCB, and to use a moisture-resistant packaging material. Additionally, the device should be stored in a dry environment, and the PCB should be designed to minimize moisture ingress.
  • The recommended soldering conditions for the STTH30RQ06WL are a peak temperature of 260°C, with a soldering time of 10-30 seconds. The device should be soldered using a solder with a melting point of 217°C or higher. It is also recommended to use a soldering iron with a temperature control system to prevent overheating.
  • To prevent EOS damage to the device, it is recommended to use a transient voltage suppressor (TVS) or a surge protection device (SPD) to protect against voltage surges and spikes. Additionally, the device should be handled and stored in an electrostatic discharge (ESD)-protected environment, and the PCB should be designed to minimize the risk of EOS damage.
  • The recommended storage conditions for the STTH30RQ06WL are a temperature range of -40°C to 125°C, and a relative humidity of 60% or less. The device should be stored in its original packaging, and should not be exposed to direct sunlight or moisture.

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STTH30RQ06WL Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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