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STTH30ST06WY - STMicroelectronics

Description: Automotive Turbo 2 ultrafast high voltage rectifier

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PCB Footprints
STTH30ST06WY - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - DO-247
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3D Models
STTH30ST06WY - STMicroelectronics  - 3D model - Transistor Outline, Vertical - DO-247
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STTH30ST06WY Details

  • Manufacturer Part Number:

    STTH30ST06WY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    3.6 V

  • JEDEC-95 Code:

    DO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    160 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH30ST06WY Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal pad connection, copper thickness, and via placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat dissipation.
  • Using a different gate driver than the one recommended by STMicroelectronics may affect the performance and reliability of the STTH30ST06WY. The recommended gate driver is optimized for the specific characteristics of the device, so using a different driver may require additional design considerations and potentially impact switching performance, EMI, and reliability.
  • STMicroelectronics recommends using external protection circuits, such as overvoltage protection (OVP) and overcurrent protection (OCP) devices, to ensure the device operates within its safe operating area. The specific protection circuitry required will depend on the application and operating conditions.
  • When using the STTH30ST06WY in a high-frequency switching application, it's essential to consider the device's switching characteristics, including rise and fall times, and ensure that the layout and design can handle the resulting high-frequency currents and voltages. Additionally, consider the impact of high-frequency switching on EMI and thermal performance.

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STTH30ST06WY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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