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STTH3R02S - STMicroelectronics

Description: STMICROELECTRONICS - STTH3R02S - DIODE, ULTRAFAST, 3A, 200V, DO-214AB-2

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STTH3R02S - STMicroelectronics - PCB symbol
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PCB Footprints
STTH3R02S - STMicroelectronics PCB footprint - Diodes Moulded - Diodes Moulded - SMC_3R02S
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STTH3R02S - STMicroelectronics - 3D model - Diodes Moulded - SMC_3R02S
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STTH3R02S Details

  • Manufacturer Part Number:

    STTH3R02S

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.45

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    3 µA

  • Reverse Recovery Time-Max:

    0.03 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

STTH3R02S Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STTH3R02S is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and minimizing thermal resistance.
  • A recommended PCB layout for the STTH3R02S includes using a large copper area for heat dissipation, placing the device near a heat sink or thermal pad, and minimizing the distance between the device and the heat sink.
  • To calculate power dissipation, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance of the package. You can use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • When selecting a heat sink for the STTH3R02S, consider the thermal resistance, material, and size of the heat sink. A heat sink with a low thermal resistance, high thermal conductivity, and sufficient size is recommended.

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STTH3R02S Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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