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STTH3R06S - STMicroelectronics

Description: STTH3R06S, Fast Rectifier Diode, Switching 3A max, 600V 30ns, 2-Pin, SMC

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STTH3R06S - STMicroelectronics PCB footprint - Diodes Moulded - Diodes Moulded - SMC_1.6PinLength
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STTH3R06S - STMicroelectronics  - 3D model - Diodes Moulded - SMC_1.6PinLength
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STTH3R06S Details

  • Manufacturer Part Number:

    STTH3R06S

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    45 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    3 µA

  • Reverse Recovery Time-Max:

    0.03 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

STTH3R06S Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STTH3R06S is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and minimizing thermal resistance.
  • A recommended PCB layout for the STTH3R06S includes a large copper area for heat sinking, a thermal via array, and a minimal thermal resistance path to the heat sink or ambient air.
  • To calculate power dissipation, use the formula Pd = (Vds x Ids) + (Vgs x Igs), where Pd is the power dissipation, Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.
  • Recommended gate drive circuits for the STTH3R06S include a totem pole configuration with a low-impedance gate driver, a bootstrap capacitor, and a pull-down resistor to ensure proper turn-on and turn-off characteristics.

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STTH3R06S Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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