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STTH506B - STMicroelectronics

Description: STTH506B, Rectifier Diode, Switching 5A max, 600V, 3-Pin, D-PAK

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STTH506B - STMicroelectronics PCB footprint - Other - Other - DPAK (TO-252)_5
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STTH506B - STMicroelectronics  - 3D model - Other - DPAK (TO-252)_5
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STTH506B Details

  • Manufacturer Part Number:

    STTH506B

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.85 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    55 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STTH506B Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for heat dissipation, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • When selecting a heat sink for the STTH506B, consider the device's power dissipation, ambient temperature, and airflow. Choose a heat sink with a high thermal conductivity, a large surface area, and a low thermal resistance. Ensure the heat sink is compatible with the device's package and pinout.
  • To calculate the maximum allowable power dissipation, consider the device's thermal resistance (RthJA), the maximum junction temperature (Tjmax), and the ambient temperature (Ta). Use the formula: Pdmax = (Tjmax - Ta) / RthJA. Consult the datasheet for the specific values of RthJA and Tjmax.
  • Operating the STTH506B at a higher voltage than recommended can lead to reduced reliability, increased power consumption, and potential damage to the device. It's essential to follow the recommended voltage ratings to ensure reliable operation and prevent premature failure.

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STTH506B Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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Part Image STTH506B-TR STMicroelectronics

Rectifier Diode, 1 Phase, 1 Element, 5A, 600V V(RRM), Silicon