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STTH602CSF - STMicroelectronics

Description: Ultrafast rectifier 200V, dual 2x3A,VRRM:200 V,trr(max):24 ns,Tj (max.):175 °C,VF(typ.):0.80 V.

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STTH602CSF - STMicroelectronics PCB footprint - Other - Other - STTH602CSF
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STTH602CSF Details

  • Manufacturer Part Number:

    STTH602CSF

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 3 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-11-06

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.45

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.17 V

  • JEDEC-95 Code:

    TO-277A

  • JESD-30 Code:

    R-PDSO-F3

  • Non-rep Pk Forward Current-Max:

    55 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    4 µA

  • Reverse Recovery Time-Max:

    0.031 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH602CSF Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current, and to ensure that the device is operated within the specified thermal limits. Additionally, a good thermal design, including a heat sink if necessary, can help to reduce the junction temperature and prevent thermal runaway.
  • The STTH602CSF has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2kV and a machine model (MM) of 200V are recommended for ESD protection.
  • Yes, the STTH602CSF is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard, and STMicroelectronics provides a dedicated automotive grade version of the device.
  • To troubleshoot issues with the STTH602CSF, start by checking the power supply voltage, current, and temperature. Verify that the device is operated within the specified limits, and check for any signs of overheating or electrical overstress. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for guidance on troubleshooting common issues.

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STTH602CSF Overview

Use the download button to access the STTH602CSF schematic symbol and PCB footprint.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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